( en | de | ru )

 

Disambiguation of "Du, Gang"

Author of the publication

copydeleteadd this publication to your clipboard
Self-heating Induced Variability and Reliability in Advanced Logic Devices and Circuits.

, , , , and . ASICON, page 1-4. IEEE, (2019)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Jochen Gäng

Gang Zhao

Eugen Gäng

Willy Gäng

Peter Gäng

 

Other publications of authors with the same name

Multi-bit Leveled Homomorphic Encryption via Dual.LWE -Based., , , and . Inscrypt, volume 10143 of Lecture Notes in Computer Science, page 221-242. Springer, (2016)Hole mobility in InSb-based devices: Dependency on surface orientation, body thickness and strain., , , and . ESSDERC, page 122-125. IEEE, (2014)BSTBGA: A hybrid genetic algorithm for constrained multi-objective optimization problems., and . Comput. Oper. Res., 40 (1): 282-302 (2013)Modelling, variation monitoring, analyzing, reasoning for intelligently reconfigurable Clinical Pathway., , , , and . SOLI, page 85-90. IEEE, (2009)The Innovation of Ideological and Political Education Integrating Artificial Intelligence Big Data with the Support of Wireless Network., , and . Appl. Artif. Intell., (December 2023)Mandibular Canal Segmentation From CBCT Image Using 3D Convolutional Neural Network With scSE Attention., , and . IEEE Access, (2022)Knowledge-based hybrid variance handling for patient care workflows based on clinical pathways., , , and . SOLI, page 13-18. IEEE, (2009)Self-heating Induced Variability and Reliability in Advanced Logic Devices and Circuits., , , , and . ASICON, page 1-4. IEEE, (2019)PBTI evaluation of In0.65Ga0.35As/In0.53Ga0.47As nanowire FETs with Al2O3 and LaAlO3 gate dielectrics., , , , , and . IRPS, page 7-1. IEEE, (2018)Self-Heating Effect of Device-Circuit with Back-side Power Delivery Network beyond 3nm Node., , , , , , , , and . IRPS, page 1-6. IEEE, (2024)