( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
Multisite bio-stimulating implants magnetoelectrically powered and individually programmed by a single transmitter.

, , , , , , , и . CICC, стр. 1-2. IEEE, (2021)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Jacob T Sello

Nehemia Robinson

Gnana Robinson

Yohan Robinson

Philip Robinson

 

Другие публикации лиц с тем же именем

17.1 Omnidirectional Magnetoelectric Power Transfer for Miniaturized Biomedical Implants via Active Echo., , , , , , и . ISSCC, стр. 314-316. IEEE, (2024)25.3 Toward Exponential Growth of Therapeutic Neurotechnology., , и . ISSCC, стр. 426-428. IEEE, (2024)Magnetoelectric Bio-Implants Powered and Programmed by a Single Transmitter for Coordinated Multisite Stimulation., , , , , , , и . IEEE J. Solid State Circuits, 57 (3): 818-830 (2022)FreeCam3D: Snapshot Structured Light 3D with Freely-Moving Cameras., , , , , , и . ECCV (27), том 12372 из Lecture Notes in Computer Science, стр. 309-325. Springer, (2020)Magnetoelectric backscatter communication for millimeter-sized wireless biomedical implants., , , , , , , , , и . MobiCom, стр. 432-445. ACM, (2022)High Resolution, Deep Imaging Using Confocal Time-of-Flight Diffuse Optical Tomography., , , , , и . IEEE Trans. Pattern Anal. Mach. Intell., 43 (7): 2206-2219 (2021)Enhanced Image Sensor Module for Head-Mounted Microscopes*., , , и . EMBC, стр. 826-829. IEEE, (2018)Vertical silicon nanowires as a universal platform for delivering biomolecules into living cells., , , , , , , , , и 3 other автор(ы). Proc Natl Acad Sci U S A, 107 (5): 1870--1875 (февраля 2010)Multisite bio-stimulating implants magnetoelectrically powered and individually programmed by a single transmitter., , , , , , , и . CICC, стр. 1-2. IEEE, (2021)A Mechanically Flexible Implantable Neural Interface for Computational Imaging and Optogenetic Stimulation over 5.4 × 5.4 mm 2 FoV., , , , , , и . ISSCC, стр. 288-290. IEEE, (2021)