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Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs.

, , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 26 (1): 38-52 (2007)

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Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 26 (1): 38-52 (2007)Microarchitectural floorplanning under performance and thermal tradeoff., , , , , , and . DATE, page 1288-1293. European Design and Automation Association, Leuven, Belgium, (2006)