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Chip to wafer copper direct bonding electrical characterization and thermal cycling., , , , , , , , and . 3DIC, page 1-7. IEEE, (2013)Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield., , , , , and . 3DIC, page 1-5. IEEE, (2011)Heterogeneously integrated III-V on silicon distributed feedback lasers at 1310 nm., , , , , , , , , and 1 other author(s). OFC, page 1-3. IEEE, (2015)AlGaInAs MQW Laser Regrowth on Heterogenerous InP-on-SOI: Performance for Different Silicon Cavity Designs., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2021)3D monolithic integration., , , , , , , , , and 6 other author(s). ISCAS, page 2233-2236. IEEE, (2011)Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development., , , , , , , , , and 7 other author(s). 3DIC, page 1-5. IEEE, (2019)Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields., , , , , , and . 3DIC, page 1-7. IEEE, (2019)High-Speed Heterogeneous InP-on-Si Capacitive Phase Modulators., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2018)