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Design space exploration for minimizing multi-project wafer production cost.

, , , , , and . ASP-DAC, page 783-788. IEEE, (2006)

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Multiple project wafers for medium-volume IC production., and . ISCAS (5), page 4725-4728. IEEE, (2005)Reticle Exposure Plans for Multi-Project Wafers., , , and . DDECS, page 341-344. IEEE Computer Society, (2007)A New Statistical Approach to Timing Analysis of VLSI Circuits., and . VLSI Design, page 507-. IEEE Computer Society, (1998)Reticle Floorplanning and Wafer Dicing for Multiple Project Wafers., and . ISQED, page 610-615. IEEE Computer Society, (2005)Design space exploration for minimizing multi-project wafer production cost., , , , , and . ASP-DAC, page 783-788. IEEE, (2006)Reticle floorplanning of flexible chips for multi-project wafers., and . ACM Great Lakes Symposium on VLSI, page 494-497. ACM, (2005)A Comparative Study on Dicing of Multiple Project Wafers., and . ISVLSI, page 314-315. IEEE Computer Society, (2005)