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Interactive interface of realtime 3D sound movement for embedded applications., , , , , и . ISCAS (2), стр. 520-523. IEEE, (2003)Grid Computing Solutions for Artificial Neural Network-based Electricity Market Forecasts., , и . IJCNN, стр. 4382-4386. IEEE, (2006)CGRA-ME: A unified framework for CGRA modelling and exploration., , , , , , и . ASAP, стр. 184-189. IEEE Computer Society, (2017)A 123μW standby power technique with EM-tolerant 1.8V I/O NMOS power switch in 28nm HKMG technology., , , , , , , , , и 1 other автор(ы). CICC, стр. 1-4. IEEE, (2012)DSP implementation of 3D sound localization algorithm for monaural sound source., , , и . ICECS, стр. 1061-1064. IEEE, (2001)Large Scale Business-academia Collaboration in Master Education Course., , , , , , , , , и 1 other автор(ы). CSEDU (2), стр. 159-166. INSTICC Press, (2009)978-989-8111-82-1.A 28nm High-κ metal-gate single-chip communications processor with 1.5GHz dual-core application processor and LTE/HSPA+-capable baseband processor., , , , , , , , , и 5 other автор(ы). ISSCC, стр. 156-157. IEEE, (2013)Synthesizable-from-C Embedded Processor Based on MIPS-ISA and OISC., , , и . EUC, стр. 114-123. IEEE Computer Society, (2015)Subleq⊝: An Area-Efficient Two-Instruction-Set Computer., , , и . IEEE Embed. Syst. Lett., 9 (2): 33-36 (2017)Designing and packaging technology of Renesas SIP., , , , и . ISCAS (6), стр. 5926-5929. IEEE, (2005)