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Fast chip aging prediction by product-like VMIN drift characterization on test structures., , , , , , , , , и . IRPS, стр. 3. IEEE, (2018)Effects of length scaling on electromigration in dual-damascene copper interconnects., , и . Microelectron. Reliab., 48 (4): 569-577 (2008)High Voltage Tolerant Design with Advanced Process for TV Application., , , , , , и . IRPS, стр. 1-4. IEEE, (2019)Comprehensive Quality and Reliability Management for Automotive Product., , , , и . IRPS, стр. 1-5. IEEE, (2020)Snowmass 2021 Computational Frontier CompF4 Topical Group Report: Storage and Processing Resource Access., , , , , , , , , и 10 other автор(ы). CoRR, (2022)The Dynamics of Online Consumer Reviews, и . Workshop on Information Systems and Economics (WISE), (2006)Artificial Intelligence for the Electron Ion Collider (AI4EIC)., , , , , , , , , и 88 other автор(ы). Comput. Softw. Big Sci., 8 (1): 5 (декабря 2024)Mass media and the contagion of fear: The case of Ebola in America, , , , , , , , , и 9 other автор(ы). PLoS ONE, (2015)Optimization of heat exchangers with vortex-generator fin by Taguchi method, , , и . Applied Thermal Engineering, 30 (13): 1775 - 1783 (2010)Artificial Intelligence for the Electron Ion Collider (AI4EIC)., , , , , , , , , и 85 other автор(ы). CoRR, (2023)