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Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits., , , , , , , , , и 3 other автор(ы). 3DIC, стр. 1-7. IEEE, (2009)Experimental analysis of flip-flops minimum operating voltage in 28nm FDSOI and the impact of back bias and temperature., , , , и . PATMOS, стр. 1-7. IEEE, (2014)Leveraging Sparsity with Spiking Recurrent Neural Networks for Energy-Efficient Keyword Spotting., , , , и . ICASSP, стр. 1-5. IEEE, (2023)Automatic Power Regulation Based on an Asynchronous Activity Detection and its Application to ANOC Node Leakage Reduction., , , и . ASYNC, стр. 48-57. IEEE Computer Society, (2008)Overcoming the Data Deluge Challenges with Greener Electronics., , , , , , , , , и 4 other автор(ы). ESSDERC, стр. 7-14. IEEE, (2021)Backpropagation-Based Learning Techniques for Deep Spiking Neural Networks: A Survey., , , и . IEEE Trans. Neural Networks Learn. Syst., 35 (9): 11906-11921 (сентября 2024)An efficient metric of setup time for pulsed flip-flops based on output transition time., , , , и . ICICDT, стр. 9-12. IEEE, (2013)UTBB FDSOI technology flexibility for ultra low power internet-of-things applications., , , , , и . ESSDERC, стр. 164-167. IEEE, (2015)Ultra-wide voltage range designs in fully-depleted silicon-on-insulator FETs., , , , , , , , , и 10 other автор(ы). DATE, стр. 613-618. EDA Consortium San Jose, CA, USA / ACM DL, (2013)The improbable but highly appropriate marriage of 3D stacking and neuromorphic accelerators., , , , , и . CASES, стр. 1:1-1:9. ACM, (2014)