( en | de | ru )

 

Disambiguation of "Ordonez, Juan S."

Author of the publication

copydeleteadd this publication to your clipboard
A blister-test apparatus for studies on the adhesion of materials used for neural electrodes.

, , , and . EMBC, page 2953-2956. IEEE, (2011)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Juan S Ordonez

Hsiao-Mei Juan

Alexander Juan

Pere Juan i Tous

María Elena Juan Pardo

 

Other publications of authors with the same name

Mechanical deformation of thin film platinum under electrical stimulation., , , , and . EMBC, page 1045-1048. IEEE, (2015)Ensuring minimal humidity levels in hermetic implant housings., , , and . EMBC, page 2296-2299. IEEE, (2011)Improved polyimide thin-film electrodes for neural implants., , , and . EMBC, page 5134-5137. IEEE, (2012)Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication., , , and . EMBC, page 3886-3889. IEEE, (2012)Improved long-term stability of thin-film glassy carbon electrodes through the use of silicon carbide and amorphous carbon., , , , , , , , , and 2 other author(s). NER, page 288-291. IEEE, (2017)A blister-test apparatus for studies on the adhesion of materials used for neural electrodes., , , and . EMBC, page 2953-2956. IEEE, (2011)Non-hermetic encapsulation for implantable electronic devices based on epoxy., , , , and . EMBC, page 809-812. IEEE, (2015)A polymer-metal two step sealing concept for hermetic neural implant packages., , , , and . EMBC, page 3981-3984. IEEE, (2014)Hybrid multimodal Deep Brain probe (DBS array) for advanced brain research., , , , , and . NER, page 280-283. IEEE, (2015)Mechanical deformation and chemical degradation of thin-film platinum under aging and electrical stimulation., , and . NER, page 166-169. IEEE, (2017)