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Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs.

K. Wang, Y. Ma, S. Dong, Y. Wang, X. Hong, and J. Cong. ASP-DAC, page 261-266. IEEE, (2011)

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Yuchun Li

Yuchun Ding

Yuzhao Ma

Characterization of higher order modes in optical fibersY. Ma. Uni Erlangen-Nürnberg, (2009)

Jingxiang Ma

Lan Ma

Other publications of authors with the same name

VLSI floorplanning with boundary constraints based on corner block list.Y. Ma, S. Dong, X. Hong, Y. Cai, C. Cheng, and J. Gu. ASP-DAC, page 509-514. ACM, (2001)LP based white space redistribution for thermal via planning and performance optimization in 3D ICs.X. Li, Y. Ma, X. Hong, S. Dong, and J. Cong. ASP-DAC, page 209-212. IEEE, (2008)Automatic enhanced CDFG generation based on runtime instrumentation.Z. Yuan, Y. Ma, J. Bian, and K. Zhao. CSCWD, page 92-97. IEEE, (2013)Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs.K. Wang, Y. Ma, S. Dong, Y. Wang, X. Hong, and J. Cong. ASP-DAC, page 261-266. IEEE, (2011)Floorplanning with Abutment Constraints and L-Shaped/T-Shaped Blocks based on Corner Block List.Y. Ma, X. Hong, S. Dong, Y. Cai, C. Cheng, and J. Gu. DAC, page 770-775. ACM, (2001)An integrated floorplanning with an efficient buffer planning algorithm.Y. Ma, X. Hong, S. Dong, S. Chen, Y. Cai, C. Cheng, and J. Gu. ISPD, page 136-142. ACM, (2003)Novel and efficient min cut based voltage assignment in gate level.T. Lin, S. Dong, S. Chen, Y. Ma, O. He, and S. Goto. ISQED, page 150-155. IEEE, (2011)Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs.Z. Li, Y. Ma, Q. Zhou, Y. Cai, Y. Xie, and T. Huang. Integr., 46 (1): 1-9 (2013)An effective buffer planning algorithm for IP based fixed-outline SOC placement.O. He, S. Dong, J. Bian, Y. Ma, and X. Hong. ACM Great Lakes Symposium on VLSI, page 564-569. ACM, (2007)Incremental layout optimization for NoC designs based on MILP formulation.J. Liu, Y. Ma, N. Xu, and Y. Wang. ASICON, page 357-360. IEEE, (2011)

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Disambiguation of "Ma, Yuchun"

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Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs.

Please choose a person to relate this publication to

Yuchun Li

Yuchun Ding

Yuzhao Ma

Jingxiang Ma

Lan Ma

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Ma, Yuchun"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs.

Please choose a person to relate this publication to

Yuchun Li

Yuchun Ding

Yuzhao Ma

Jingxiang Ma

Lan Ma

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs.