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Integrated RF components in a SiGe bipolar technology., , , , , , , и . IEEE J. Solid State Circuits, 32 (9): 1440-1445 (1997)16.1 An ultra-thin flexible CMOS stress sensor demonstrated on an adaptive robotic gripper., , , и . ISSCC, стр. 1-3. IEEE, (2015)Status and trends of silicon RF technology.. Microelectron. Reliab., 41 (1): 13-19 (2001)Ultra-thin relative humidity sensors for hybrid system-in-foil applications., , , , , , и . IEEE SENSORS, стр. 1-3. IEEE, (2017)Front-End Electronics for Beta-Cell Function Monitoring with an Integrated FOPP Detector., , , , , и . IEEE SENSORS, стр. 1-4. IEEE, (2021)Comprehensive compact electro-thermal GaN HEMT model., , , , и . ESSDERC, стр. 196-199. IEEE, (2017)Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips., , , , , и . ESSDERC, стр. 210-213. IEEE, (2014)600 V, low-leakage AlGaN/GaN MIS-HEMT on bulk GaN substrates., , , , , , и . ESSDERC, стр. 202-205. IEEE, (2016)An Integrated Optical Transceiver Circuit for Power Delivery and Bi-directional Data Communication in a Medical Catheter Device., , , , , и . ESSCIRC, стр. 185-188. IEEE, (2022)A 0.25µm logarithmic CMOS imager for emissivity-compensated thermography., , , , , и . ISSCC, стр. 354-355. IEEE, (2009)