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Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires.

, , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (12): 3137-3150 (2018)

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Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation., , , , and . ISQED, page 386-391. IEEE, (2014)An efficient statistical chip-level total power estimation method considering process variations with spatial correlation., , and . ISQED, page 671-676. IEEE, (2011)EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks., , , and . CoRR, (2020)A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method., , , , , , , and . IEEE Trans. Computers, 67 (5): 617-630 (2018)EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks., , , , and . IEEE Trans. Very Large Scale Integr. Syst., 27 (4): 940-953 (2019)Partial random walk for large linear network analysis., , , and . ISCAS (5), page 173-177. IEEE, (2004)Battery state of charge estimation using adaptive subspace identification method., , , , , and . ASICON, page 91-94. IEEE, (2011)Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network., , and . ISQED, page 173-178. IEEE, (2016)SBPOR: Second-Order Balanced Truncation for Passive Order Reduction of RLC Circuits., , , and . DAC, page 158-161. IEEE, (2007)DeMOR: decentralized model order reduction of linear networks with massive ports., , , , and . DAC, page 409-414. ACM, (2008)