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Optoelectronic devices for optogenetics: From rodents to non-human primates.

J. Lee, I. Ozden, Y. Song, и A. Nurmikko. BioCAS, стр. 1-4. IEEE, (2015)

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Arto Klami

Arto Kangasniemi

Arto Laitinen

Rafael Arto-Haumacher

Arto Kuorikoski

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Multi-coil High Efficiency Wireless Charger System for Hermetically Sealed Biomedical Implants.J. Lee, и A. Nurmikko. BioCAS, стр. 1-4. IEEE, (2018)Optoelectronic devices for optogenetics: From rodents to non-human primates.J. Lee, I. Ozden, Y. Song, и A. Nurmikko. BioCAS, стр. 1-4. IEEE, (2015)Demo: A Software-Defined Radio for Wireless Brain Implants Network.H. Cai, M. Lokhandwala, J. Zhu, C. Kilfoyle, J. Lee, L. Larson, A. Nurmikko, F. Laiwalla, и V. Leung. MobiCom, стр. 852-854. ACM, (2018)A 100-channel hermetically sealed implantable device for wireless neurosensing applications.M. Yin, D. Borton, J. Aceros, W. Patterson, и A. Nurmikko. ISCAS, стр. 2629-2632. IEEE, (2012)Polymeric packaging for fully implantable wireless neural microsensors.J. Aceros, M. Yin, D. Borton, W. Patterson, C. Bull, и A. Nurmikko. EMBC, стр. 743-746. IEEE, (2012)Improving Wireless Power Transfer Efficiency for Distributed Brain Implants using Auto-Tune OVP.V. Leung, A. Lee, J. Lee, S. Alluri, J. Alonzo, L. Mello, B. Beyer, D. Durfee, W. Lau, P. Asbeck и 3 other автор(ы). BioCAS, стр. 1-5. IEEE, (2023)FPGA implementation of deep-learning recurrent neural networks with sub-millisecond real-time latency for BCI-decoding of large-scale neural sensors (104 nodes).C. Heelan, A. Nurmikko, и W. Truccolo. EMBC, стр. 1070-1073. IEEE, (2018)An Implantable Wireless Network of Distributed Microscale Sensors for Neural Applications.J. Lee, E. Mok, J. Huang, L. Cui, A. Lee, V. Leung, P. Mercier, S. Shellhammer, L. Larson, P. Asbeck и 4 other автор(ы). NER, стр. 871-874. IEEE, (2019)A Distributed Ensemble of wireless Intracortical Microdevices for Charge-balanced Photovoltaic Current Stimulation.A. Lee, J. Lee, K. Choquette, Y. Song, и A. Nurmikko. NER, стр. 613-616. IEEE, (2021)A CMOS Distributed Sensor System for High-Density Wireless Neural Implants for Brain-Machine Interfaces.V. Leung, J. Lee, S. Li, S. Yu, C. Kilfoyle, L. Larson, A. Nurmikko, и F. Laiwalla. ESSCIRC, стр. 230-233. IEEE, (2018)

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