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3D clock distribution using vertically/horizontally-coupled resonators.

, , , and . ISSCC, page 258-259. IEEE, (2013)

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Transceiver circuits for pulse-based ultra-wideband., , , and . ISCAS (4), page 349-352. IEEE, (2004)A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler., , , , , , , and . ISSCC, page 200-201. IEEE, (2013)3D clock distribution using vertically/horizontally-coupled resonators., , , and . ISSCC, page 258-259. IEEE, (2013)1W 3.3V-to-16.3V boosting wireless power transfer circuits with vector summing power controller., , , and . A-SSCC, page 177-180. IEEE, (2011)Low-latency wireless 3D NoCs via randomized shortcut chips., , , , , , , , and . DATE, page 1-6. European Design and Automation Association, (2014)A 107pJ/b 100kb/s 0.18μm Capacitive-Coupling Transceiver for Printable Communication Sheet., , , , , , , , and . ISSCC, page 292-293. IEEE, (2008)Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing., , , , , , , and . ISSCC, page 470-471. IEEE, (2009)Wireless power transfer to stacked modules for IoT sensor nodes., , , , and . ISOCC, page 59-60. IEEE, (2017)A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel., , , , , and . IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 98-A (12): 2584-2591 (2015)Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs., , , , and . IEICE Trans. Inf. Syst., 96-D (12): 2753-2764 (2013)