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Disambiguation of "Lee, Yu-Min"

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HiPRIME: hierarchical and passivity reserved interconnect macromodeling engine for RLKC power delivery.

, , , and . DAC, page 379-384. ACM, (2002)

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Min Lee

Min-Hi Lee

Induction and regulation of antiviral defence mechanisms through intracytoplasmic sensors. HU Berlin, (2009)

Yü Min Hsiao

Jian-min Yu

Yu Xian-Min

 

Other publications of authors with the same name

Redundant via insertion under timing constraints., and . ISQED, page 627-633. IEEE, (2011)An efficient method for analyzing on-chip thermal reliability considering process variations., and . ACM Trans. Design Autom. Electr. Syst., 18 (3): 41:1-41:32 (2013)Incremental transient simulation of power grid., , , and . ISPD, page 93-100. ACM, (2014)Integrating E-services with a Telecommunication E-commerce using Service-Oriented Architecture., and . J. Softw., 3 (9): 60-67 (2008)Post-routing redundant via insertion with wire spreading capability., , and . ASP-DAC, page 468-473. IEEE, (2009)A Process-Oriented System Dynamics Model for Software Development Project Prediction., , , and . NCM (2), page 126-131. IEEE Computer Society, (2008)978-0-7695-3322-3.Linear Time Hierarchical Capacitance Extraction without Multipole Expansion., , , , and . ICCD, page 98-103. IEEE Computer Society, (2001)A multiple supply voltage based power reduction method in 3-D ICs considering process variations and thermal effects., , and . ASP-DAC, page 55-60. IEEE, (2009)On-chip statistical hot-spot estimation using mixed-mesh statistical polynomial expression generating and skew-normal based moment matching techniques., , and . ASP-DAC, page 603-608. IEEE, (2012)NUMANA: a hybrid <u>num</u>erical and <u>ana</u>lytical thermal simulator for 3-D ICs., , , and . DATE, page 1379-1384. EDA Consortium San Jose, CA, USA / ACM DL, (2013)