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Disambiguation of "Kim, Heegon"

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Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.

, , , , , , and . 3DIC, page 1-6. IEEE, (2014)

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Ky ng Kim

Die Artikelstruktur in passiven zweisprachigen Wörterbüchern Deutsch-Koreanisch: Konzeption zur Erstellung eines zweisprachigen Lernerwörterbuchs Deutsch-Koreanisch. Uni Heidelberg, (2008)

Bongcheol Kim

Kim Gerber

Taekwan Kim

Ryong Kim

 

Other publications of authors with the same name

Power-Time Tradeoff of Parallel Execution on Multi-core Platforms., , and . MUSIC, volume 274 of Lecture Notes in Electrical Engineering, page 157-163. Springer, (2013)TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC., , , , , , and . EMC Compo, page 212-215. IEEE, (2015)Fault detection and isolation of multiple defects in through silicon via (TSV) channel., , , , , , and . 3DIC, page 1-5. IEEE, (2014)Graph Neural Network-based Virtual Network Function Management., , , , , , , and . APNOMS, page 13-18. IEEE, (2020)Graph Neural Network based Service Function Chaining for Automatic Network Control., , , and . APNOMS, page 7-12. IEEE, (2020)Detecting Ripeness of Strawberry and Coordinates of Strawberry Stalk using Deep Learning., , , , , and . ICUFN, page 454-458. IEEE, (2022)Modeling and analysis of open defect in through silicon via (TSV) channel., , , , , and . EMC Compo, page 163-166. IEEE, (2013)Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling., , , , , , , and . EMC Compo, page 5-9. IEEE, (2013)Machine Learning based Link State Aware Service Function Chaining., , , and . APNOMS, page 1-4. IEEE, (2019)Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module., , , , , and . 3DIC, page TS2.2.1-TS2.2.4. IEEE, (2015)