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AutoMap: Automatic Mapping of Neural Networks to Deep Learning Accelerators for Edge Devices.

, , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (9): 2994-3006 (September 2023)

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AutoMap: Automatic Mapping of Neural Networks to Deep Learning Accelerators for Edge Devices., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (9): 2994-3006 (September 2023)Compact models and model standard for 2.5D and 3D integration., and . SLIP, page 7:1-7:7. IEEE Computer Society, (2014)3DHLS: Incorporating high-level synthesis in physical planning of three-dimensional (3D) ICs., , , and . DATE, page 1185-1190. IEEE, (2012)3DLAT: TSV-based 3D ICs crosstalk minimization utilizing Less Adjacent Transition code., , , and . ASP-DAC, page 762-767. IEEE, (2014)System-level design space exploration for three-dimensional (3D) SoCs., , , and . CODES+ISSS, page 385-388. ACM, (2011)TSV power supply array electromigration lifetime analysis in 3D ICS., , , and . ACM Great Lakes Symposium on VLSI, page 239-240. ACM, (2014)Designing vertical bandwidth reconfigurable 3D NoCs for many core systems., , , , and . 3DIC, page 1-7. IEEE, (2014)Single-Pass On-Line Event Detection in Twitter Streams., , and . ICMLC, page 522-529. ACM, (2021)Augmenting aspect-level sentiment classification with distance-related local context input., , and . J. Supercomput., 79 (10): 11198-11217 (July 2023)Pinatubo: a processing-in-memory architecture for bulk bitwise operations in emerging non-volatile memories., , , , , and . DAC, page 173:1-173:6. ACM, (2016)