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Minimizing rework costs in multistage production processes by modifying quality specification limits., and . ICIT, page 831-836. IEEE, (2017)Photonic Integrated Circuits for Terahertz Communication: The Hybrid Integrated Microwave Photonic approach., , , , , , , , and . OFC, page 1-2. IEEE, (2021)Hybrid Photonic Integrated Circuits for Quantum Communications., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2024)Demonstration of On-Chip Optical Frequency Comb Generation and Optical Injection Locking., , , , , , , , , and 12 other author(s). OFC, page 1-3. IEEE, (2024)A multivariate process capability index that complies with industry requirements., , , , and . IECON, page 4601-4606. IEEE, (2016)Novel integration technologies for disruptive capacity upgrade in data center systems., , , , , , , , , and 1 other author(s). OFC, page 1-3. IEEE, (2016)32 GBd 16QAM Wireless Transmission in the 300 GHz Band using a PIN Diode for THz Upconversion., , , , , , , , and . OFC, page 1-3. IEEE, (2019)Hybrid Polymer Integration for Communications, Sensing and Quantum Technologies from the Visible to the Infrared., , , , , , , , , and 2 other author(s). ECOC, page 1-4. IEEE, (2021)Hybrid Polymer THz Receiver PIC with Waveguide Integrated Photoconductive Antenna: Concept and 1st Characterization Results., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2022)Bi-directional, crosstalk-suppressed, 40-nm wavelength tuneable colourless ONU on polymer platform., , , , , , , and . ECOC, page 1-3. IEEE, (2014)