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Enabling Active Backside Technology for ESD and LU Reliability in DTCO/STCO.

K. Serbulova, S. Chen, G. Hellings, A. Veloso, A. Jourdain, D. Linten, J. Boeck, G. Groeseneken, J. Ryckaert, G. der Plas, E. Beyne, E. Litta, and N. Horiguchi. VLSI Technology and Circuits, page 431-432. IEEE, (2022)

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Julien Köhrle

Julien Ndinga

Julien Bonnamour

Julien Béthune

Julien Coignet

Other publications of authors with the same name

Design technology co-optimization for enabling 5nm gate-all-around nanowire 6T SRAM.T. Bao, S. Sakhare, J. Ryckaert, D. Yakimets, A. Mercha, D. Verkest, A. Thean, and P. Wambacq. ICICDT, page 1-4. IEEE, (2015)Impact of interconnects enhancement on SRAM design beyond 5nm technology node.M. Gupta, P. Weckx, M. Komalan, and J. Ryckaert. ISCAS, page 1-5. IEEE, (2023)Design Technology co-optimization of 1D-1VCMA to improve read performance for SCM applications.M. Gupta, M. Perumkunnil, D. Biswas, S. Chamazcoti, G. Kar, A. Furnémont, and J. Ryckaert. ISCAS, page 1-5. IEEE, (2023)Low-power, low-penalty, flip-chip integrated, 10Gb/s ring-based 1V CMOS photonics transmitter.M. Rakowski, M. Pantouvaki, H. Yu, W. Bogaerts, K. Meyer, M. Steyaert, B. Snyder, P. O'Brien, J. Ryckaert, P. Absil and 1 other author(s). OFC/NFOEC, page 1-3. IEEE, (2013)Multirate Cascaded Discrete-Time Low-Pass ΔΣ Modulator for GSM/Bluetooth/UMTS.L. Bos, G. Vandersteen, P. Rombouts, A. Geis, A. Morgado, Y. Rolain, G. der Plas, and J. Ryckaert. IEEE J. Solid State Circuits, 45 (6): 1198-1208 (2010)Scaling Beyond 7nm: Design-Technology Co-optimization at the Rescue.J. Ryckaert. ISPD, page 89. ACM, (2016)Optimized Signal Acquisition for Low-Complexity and Low-Power IR-UWB Transceivers.C. Desset, M. Badaroglu, J. Ryckaert, and B. van Poucke. VTC Spring, page 3135-3139. IEEE, (2007)Human++: autonomous wireless sensors for body area networks.B. Gyselinckx, C. Hoof, J. Ryckaert, R. Yazicioglu, P. Fiorini, and V. Leonov. CICC, page 13-19. IEEE, (2005)A 16mA UWB 3-to-5GHz 20Mpulses/s Quadrature Analog Correlation Receiver in 0.18µm CMOS.J. Ryckaert, M. Badaroglu, V. Heyn, G. der Plas, P. Nuzzo, A. Baschirotto, S. D'Amico, C. Desset, H. Suys, M. Libois and 3 other author(s). ISSCC, page 368-377. IEEE, (2006)Holisitic device exploration for 7nm node.P. Raghavan, M. Bardon, D. Jang, P. Schuddinck, D. Yakimets, J. Ryckaert, A. Mercha, N. Horiguchi, N. Collaert, A. Mocuta and 5 other author(s). CICC, page 1-5. IEEE, (2015)

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Disambiguation of "Ryckaert, Julien"

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Enabling Active Backside Technology for ESD and LU Reliability in DTCO/STCO.

Please choose a person to relate this publication to

Julien Köhrle

Julien Ndinga

Julien Bonnamour

Julien Béthune

Julien Coignet

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Ryckaert, Julien"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Enabling Active Backside Technology for ESD and LU Reliability in DTCO/STCO.

Please choose a person to relate this publication to

Julien Köhrle

Julien Ndinga

Julien Bonnamour

Julien Béthune

Julien Coignet

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Enabling Active Backside Technology for ESD and LU Reliability in DTCO/STCO.