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Critical Nodes Identification in Large Networks: The Inclined and Detached Models.

, , , , , and . World Wide Web, 25 (3): 1315-1341 (2022)

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Stacked solder bumping technology for improved solder joint reliability., , , and . Microelectron. Reliab., 41 (12): 1979-1992 (2001)Critical Nodes Identification in Large Networks: An Inclination-Based Model., , , , , and . WISE (1), volume 13080 of Lecture Notes in Computer Science, page 453-468. Springer, (2021)Effect of substrate flexibility on solder joint reliability., , , and . Microelectron. Reliab., 42 (12): 1883-1891 (2002)Critical Nodes Identification in Large Networks: The Inclined and Detached Models., , , , , and . World Wide Web, 25 (3): 1315-1341 (2022)