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Heterogeneous 3-d stacking, can we have the best of both (technology) worlds?. ISPD, стр. 1-2. ACM, (2013)6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters., , , , , , , , , и 5 other автор(ы). ISSCC, стр. 120-121. IEEE, (2014)A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters., , , , , , , , , и 5 other автор(ы). IEEE J. Solid State Circuits, 50 (1): 258-269 (2015)Memory capacity of three-layer neural networks with non-polynomial activations.. CoRR, (2024)Online Sparse Subspace Clustering., , и . DSW, стр. 248-252. IEEE, (2019)Online Stochastic Gradient Methods Under Sub-Weibull Noise and the Polyak-Łojasiewicz Condition., , и . CDC, стр. 3499-3506. IEEE, (2022)Upper and lower memory capacity bounds of transformers for next-token prediction., , и . CoRR, (2024)A Stochastic Operator Framework for Inexact Static and Online Optimization., , , и . CoRR, (2021)A programmable RFSoC in 16nm FinFET technology for wideband communications., , , , , , , , , и 5 other автор(ы). A-SSCC, стр. 1-4. IEEE, (2017)Sketching the Best Approximate Quantum Compiling Problem., , и . QCE, стр. 492-502. IEEE, (2022)