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A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function.

, , , , , , , , , , , , , , , , , , , , , и . IEEE J. Solid State Circuits, 58 (11): 2955-2964 (ноября 2023)

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Jianzhong Jiang

Jiang Zhang

Andong Jiang

Minhua Jiang

Kaixi Jiang

 

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