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A CMOS-based Characterisation Platform for Emerging RRAM Technologies.

, , , , , , , , , , , , , и . ISCAS, стр. 75-79. IEEE, (2022)

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Yühe Feng

Feng Yan

Feng Shi

Feng Qiu

Zhaoyong Feng

 

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Robust Wireless Power Transfer to Multiple mm-Scale Freely-Positioned Neural Implants., и . BioCAS, стр. 1-4. IEEE, (2018)Hardware-Efficient Compression of Neural Multi-Unit Activity., , , и . IEEE Access, (2022)Autonomous Wireless System for Robust and Efficient Inductive Power Transmission to Multi-Node Implants., и . ISCAS, стр. 1-5. IEEE, (2021)Open-Source Memory Compiler for Automatic RRAM Generation and Verification., , , и . MWSCAS, стр. 97-100. IEEE, (2021)Millimeter-scale integrated and wirewound coils for powering implantable neural microsystems., , , и . BioCAS, стр. 1-4. IEEE, (2017)A CMOS-based Characterisation Platform for Emerging RRAM Technologies., , , , , , , , , и 4 other автор(ы). ISCAS, стр. 75-79. IEEE, (2022)Microwire-CMOS integration of mm-scale neural probes for chronic local field potential recording., , , , , и . BioCAS, стр. 1-4. IEEE, (2017)Towards a Distributed, Chronically-Implantable Neural Interface., , , , , , , , , и 2 other автор(ы). NER, стр. 719-724. IEEE, (2019)Autonomous SoC for Neural Local Field Potential Recording in mm-Scale Wireless Implants., , , , , и . ISCAS, стр. 1-5. IEEE, (2018)Towards a wireless micropackaged implant with hermeticity monitoring., , , , и . BioCAS, стр. 500-504. IEEE, (2022)