( en | de | ru )

 

Disambiguation of "Yasin, Muhammad"

Author of the publication

copydeleteadd this publication to your clipboard
TTLock: Tenacious and traceless logic locking.

, , , and . HOST, page 166. IEEE Computer Society, (2017)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Yasin Mohammed Yasin

Yasin Elshorbany

Investigation of the Tropospheric Oxidation Capacity and Ozone Photochemical Formation in the City of Santiago de Chile -Field Measurements and Modelling Study-. Uni Wuppertal, (2009)

Hussien Jemal Yasin

Muhammad Muhammad

Yasin Mahdi

 

Other publications of authors with the same name

Unified, ultra compact, quadratic power proxies for multi-core processors., , and . DATE, page 1-4. European Design and Automation Association, (2014)KRATT: QBF-Assisted Removal and Structural Analysis Attack Against Logic Locking., , and . CoRR, (2023)Transforming between logic locking and IC camouflaging., and . IDT, page 1-4. IEEE, (2015)SFLL-HLS: Stripped-Functionality Logic Locking Meets High-Level Synthesis., , and . ICCAD, page 1-4. ACM, (2019)Revisiting Logic Locking for Reversible Computing., , and . ETS, page 1-6. IEEE, (2019)Ultra compact, quadratic power proxies for multi-core processors., , and . ICECS, page 954-957. IEEE, (2013)A Comparative Study on Frequent Link Disconnection problems in VANETs., , , , , , and . EAI Endorsed Trans. Energy Web, 5 (17): e2 (2018)KRATT: QBF-Assisted Removal and Structural Analysis Attack Against Logic Locking., , and . DATE, page 1-6. IEEE, (2024)Effect of micro/nano-SiO$_2$ on mechanical, thermal, and electrical properties of silicone rubber, epoxy, and EPDM composites for outdoor electrical insulations., , , , and . Turkish J. Electr. Eng. Comput. Sci., (2017)Logic Locking With Provable Security Against Power Analysis Attacks., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 39 (4): 766-778 (2020)