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A Through-Hole Capacitive Micromachined Ultrasonic Transdcuer with High Perfromance.

, , , , , , , , , и . NEMS, стр. 181-186. IEEE, (2019)

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Jiong Guo

Guo Cheng

Xinrong Guo

Xin Guo

Baoliang Guo

 

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