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Characterization, Modeling, and Test of Intermediate State Defects in STT-MRAMs.

, , , , , и . IEEE Trans. Computers, 71 (9): 2219-2233 (2022)

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Jan-Erik Schmutz

Adhäsions- und Abriebuntersuchungen mittels rasterkraftmikroskopischer Techniken auf der Mikro- und Nanoskala. Uni Münster, (2009)

Nilgün Erikli

Anders Erikson

Jan Erik Spitzley

Jan Erik Eickbohm

 

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An Industrial Approach to Core-Based System Chip Testing.. VLSI-SOC, том 218 из IFIP Conference Proceedings, стр. 389-400. Kluwer, (2001)How Useful are the ITC 02 SoC Test Benchmarks?, и . IEEE Des. Test Comput., 19 (5): 120, 119 (2002)SOC test architecture design for efficient utilization of test bandwidth., и . ACM Trans. Design Autom. Electr. Syst., 8 (4): 399-429 (2003)Guest Editors' Introduction: Addressing the Challenges of Debug and Diagnosis., и . IEEE Des. Test Comput., 25 (3): 206-207 (2008)Conference Reports., , , , , и . IEEE Des. Test Comput., 23 (4): 262-265 (2006)Device-Aware Test for Back-Hopping Defects in STT-MRAMs., , , , , , , , и . DATE, стр. 1-6. IEEE, (2023)Characterization, Modeling and Test of Synthetic Anti-Ferromagnet Flip Defect in STT-MRAMs., , , , , и . ITC, стр. 1-10. IEEE, (2020)On Scan Chain Diagnosis for Intermittent Faults., , , и . Asian Test Symposium, стр. 47-54. IEEE Computer Society, (2009)IEEE Std 1500 Compliant Infrastructure forModular SOC Testing., , и . Asian Test Symposium, стр. 450. IEEE Computer Society, (2005)Automation of 3D-DfT Insertion., , , , , , и . Asian Test Symposium, стр. 395-400. IEEE Computer Society, (2011)