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Disambiguation of "yao Chang, Zu"

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A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes.

, , , , , , , , , , and . ISSCC, page 186-188. IEEE, (2018)

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Chang Yao

Hyi-yao Chang

Tsen-Yao Chang

Chi-Yao Chang

Yao Yao

 

Other publications of authors with the same name

An eddy-current displacement-to-digital converter based on a ratio-metric delta-sigma ADC., , , , , and . ESSCIRC, page 403-406. IEEE, (2014)A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink., , , , , , , and . VLSI Technology and Circuits, page 1-2. IEEE, (2023)An Element-Matched Electromechanical ΔΣ ADC for Ultrasound Imaging., , , , , , and . IEEE J. Solid State Circuits, 53 (10): 2795-2805 (2018)A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays., , , , , , , and . ESSCIRC, page 163-166. IEEE, (2021)A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes., , , , , , , , , and 1 other author(s). ESSCIRC, page 211-214. IEEE, (2017)A 7 μW Offset- and Temperature-Compensated pH-to-Digital Converter., , , , , and . J. Sensors, (2017)A front-end ASIC with receive sub-array beamforming integrated with a 32 × 32 PZT matrix transducer for 3-D transesophageal echocardiography., , , , , , , , , and 4 other author(s). VLSI Circuits, page 1-2. IEEE, (2016)An Integrated Programmable High-Voltage Bipolar Pulser With Embedded Transmit/Receive Switch for Miniature Ultrasound Probes., , , , , , and . ESSCIRC, page 79-82. IEEE, (2019)A front-end ASIC with high-voltage transmit switching and receive digitization for forward-looking intravascular ultrasound., , , , , , , , , and 1 other author(s). CICC, page 1-4. IEEE, (2017)A Front-End ASIC With Receive Sub-array Beamforming Integrated With a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography., , , , , , , , , and 4 other author(s). IEEE J. Solid State Circuits, 52 (4): 994-1006 (2017)