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Mixed signals on mixed-signal: the right next technology., , , , , , and . DAC, page 278-279. ACM, (2003)On-chip interconnect-aware design and modeling methodology, based on high bandwidth transmission line devices., , , , , , , , , and 6 other author(s). DAC, page 724-727. ACM, (2003)RF FDSOI Technology and Modelling.. ESSCIRC, page 214. IEEE, (2018)Status and Direction of Communication Technologies - SiGe BiCMOS and RFCMOS., , , , , , , , , and 1 other author(s). Proc. IEEE, 93 (9): 1539-1558 (2005)Analog Circuit Blocks for 80-GHz Bandwidth Frequency-Interleaved, Linear, Large-Swing Front-Ends., , , , , , , and . IEEE J. Solid State Circuits, 51 (9): 1985-1993 (2016)A 21-27GHz self-shielded 4-way power-combining PA balun., , , and . CICC, page 617-620. IEEE, (2004)Integrated RF components in a SiGe bipolar technology., , , , , , , and . IEEE J. Solid State Circuits, 32 (9): 1440-1445 (1997)A scalable high-frequency noise model for bipolar transistors with application to optimal transistor sizing for low-noise amplifier design., , , , , , , and . IEEE J. Solid State Circuits, 32 (9): 1430-1439 (1997)Silicon-germanium BiCMOS technology and a CAD environment for 2-40 GHz VLSI mixed-signal ICs., , , , , , , , , and 7 other author(s). CICC, page 559-566. IEEE, (2001)Evolution and Optimization of BEOL MOM Capacitors Across Advanced CMOS Nodes., , , , , , , , , and . ESSDERC, page 190-193. IEEE, (2018)