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Heterogeneous Co-Integration of BTO/Si and III-V Technology on a Silicon Photonics Platform.

, , , , , , , , , и . OFC, стр. 1-3. IEEE, (2020)

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Martin Lukasiewycz

Martin Heinrich Lukas

Rainer Friedrich Wilhelm Lukas

Kurt Lukas

Charlotte Lukas

 

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Heterogeneous Co-Integration of BTO/Si and III-V Technology on a Silicon Photonics Platform., , , , , , , , , и . OFC, стр. 1-3. IEEE, (2020)Monolithic Integration of III -V on silicon for photonic and electronic applications., , , , , , , , , и 1 other автор(ы). DRC, стр. 1-2. IEEE, (2018)CMOS-Compatible Hybrid III-V/Si Photodiodes Using a Lateral Current Collection Scheme., , , , , , , , и . ECOC, стр. 1-3. IEEE, (2018)High-Performance InGaAs-on-Silicon Technology Platform For Logic and RF Applications., , , , , и . BCICTS, стр. 1-6. IEEE, (2019)Ultra-Thin III-V Photodetectors Epitaxially Integrated on Si with Bandwidth Exceeding 25 GHz., , , , , , , и . OFC, стр. 1-3. IEEE, (2020)Barium-titanate integrated with silicon photonics for ultra-efficient electro-optical performance., , , , , , , , , и 1 other автор(ы). ECOC, стр. 1-3. IEEE, (2015)CMOS-embedded lasers for advanced silicon photonic devices., , , , , , , , , и 1 other автор(ы). ICTON, стр. 1-4. IEEE, (2017)BTO-enhanced silicon photonics - a scalable PIC platform with ultra-efficient electro-optical modulation., и . OFC, стр. 1-3. IEEE, (2022)Novel CMOS-Compatible Ultralow Capacitance Hybrid III-V/Si Photodetectors Tested up to 32 Gbps NRZ., , , , , , , и . OFC, стр. 1-3. IEEE, (2019)Scalability of ultra-thin-body and BOX InGaAs MOSFETs on silicon., , , , , , , , и . ESSDERC, стр. 143-146. IEEE, (2013)