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A 3.96μm, 124dB Dynamic Range, 6.2mW Stacked Digital Pixel Sensor with Monochrome and Near-Infrared Dual-Channel Global Shutter Capture., , , , , , , , , и 10 other автор(ы). VLSI Technology and Circuits, стр. 1-2. IEEE, (2023)A structured routing architecture and its design methodology suitable for high-throughput electron beam direct writing with character projection., , , , , и . ISPD, стр. 69-76. ACM, (2013)A Consideration on LUT Linearization of Stochastic ADC in Sub-Ranging Architecture., , , , , и . MWSCAS, стр. 408-411. IEEE, (2018)Experimental demonstration of stochastic comparators for fine resolution ADC without calibration., , , , и . ICECS, стр. 29-32. IEEE, (2016)Digitally-Controlled Compensation Current Injection to ATE Power Supply for Emulation of Customer Environment., , , , , , и . J. Electron. Test., 34 (2): 147-161 (2018)A Technique for Analyzing On-Chip Power Supply Impedance., , , , и . ATS, стр. 193-198. IEEE Computer Society, (2015)Power supply impedance emulation to eliminate overkills and underkills due to the impedance difference between ATE and customer board., , , , , , и . ITC, стр. 1-8. IEEE, (2016)COOL interconnect low power interconnection technology for scalable 3D LSI design., , , , , , , , , и 2 other автор(ы). COOL Chips, стр. 1-3. IEEE Computer Society, (2011)High-throughput electron beam direct writing of VIA layers by character projection using character sets based on one-dimensional VIA arrays with area-efficient stencil design., , , , , и . ASP-DAC, стр. 255-260. IEEE, (2013)Extension of power supply impedance emulation method on ATE for multiple power domain., , , , , , и . ETS, стр. 1-2. IEEE, (2017)