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Design of compact LC lowpass filters based on coaxial through-silicon vias array.

X. Yin, F. Wang, V. Pavlidis, X. Liu, Q. Lu, T. Zhang, and Y. Liu. Microelectron. J., (2021)

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Liu Liu

Jiaru Liu

Anding Liu

Other publications of authors with the same name

Capacitance characterization of tapered through-silicon-via considering MOS effect.F. Wang, Z. Zhu, Y. Yang, X. Liu, and R. Ding. Microelectron. J., 45 (2): 205-210 (2014)Voltage Reference With Linear-Temperature-Dependent Power Consumption.H. Zhuang, X. Liu, and H. Wang. IEEE Trans. Very Large Scale Integr. Syst., 28 (4): 1043-1049 (2020)Voltage Comparator With 60% Faster Speed by Using Charge Pump.H. Zhuang, H. Tang, and X. Liu. IEEE Trans. Circuits Syst., 67-II (12): 2923-2927 (2020)Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.Y. Yang, X. Liu, Z. Zhu, and R. Ding. IEICE Electron. Express, 11 (14): 20140504 (2014)A multiscale region-based approach to automatic SAR image registration using CLPSO.G. Wang, X. Liu, L. Jiao, and S. Wang. IGARSS, page 5226-5229. IEEE, (2014)Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband.X. Liu, Y. Liu, T. Zhang, Q. Lu, and Z. Zhu. IEEE Trans. Circuits Syst. II Express Briefs, 70 (2): 526-530 (February 2023)Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV).Y. Liu, Z. Zhu, X. Liu, H. Gu, and L. Guo. IEICE Electron. Express, 15 (24): 20180878 (2018)A Ka-band fourth-order SIW filter power divider with wide out-of-band suppression.C. Fan, X. Liu, N. Liu, and Y. Yang. Microelectron. J., (March 2023)A Composite Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Fields.L. Wang, X. Liu, Y. En, and Z. Zhu. IEEE Trans. Circuits Syst. II Express Briefs, 70 (2): 521-525 (February 2023)Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.Y. Liu, Z. Zhu, R. Ding, X. Liu, Q. Lu, X. Yin, and Y. Yang. APCCAS, page 439-442. IEEE, (2018)

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Disambiguation of "Liu, Xiaoxian"

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Design of compact LC lowpass filters based on coaxial through-silicon vias array.

Please choose a person to relate this publication to

Liu Liu

Liu Liu

Liu Liu

Jiaru Liu

Anding Liu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Liu, Xiaoxian"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Design of compact LC lowpass filters based on coaxial through-silicon vias array.

Please choose a person to relate this publication to

Liu Liu

Liu Liu

Liu Liu

Jiaru Liu

Anding Liu

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Design of compact LC lowpass filters based on coaxial through-silicon vias array.