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Guest Editors' Introduction: Design & Test of a High-Volume 3-D Stacked Graphics Processor With High-Bandwidth Memory., and . IEEE Des. Test, 34 (1): 6-7 (2017)Guest Editors' Introduction: East Meets West., and . IEEE Des. Test Comput., 13 (1): 5-7 (1996)Guest Editors' Introduction: Design for Yield and Reliability., , , and . IEEE Des. Test Comput., 21 (3): 177-182 (2004)A D&T Roundtable: Testing Mixed Logic and DRAM Chips., , , , , , , and . IEEE Des. Test Comput., 15 (2): 86-92 (1998)Guest Editor's Introduction: Advances in Infrastructure IP.. IEEE Des. Test Comput., 20 (3): 49- (2003)IEEE Std 1500 Enables Modular SoC Testing., and . IEEE Des. Test Comput., 26 (1): 8-17 (2009)Message From the Steering Committee., , , and . IEEE Des. Test Comput., 29 (1): 5 (2012)Design & Test Education in Asia., , , , , and . IEEE Des. Test Comput., 21 (4): 331-338 (2004)Advanced ECC-Based FIT Rate Mitigation Technique for Automotive SoCs., , , , and . ITC, page 1-6. IEEE, (2018)Memory FIT Rate Mitigation Technique for Automotive SoCs., , , , , , , and . ITC, page 1-6. IEEE, (2019)