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Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).

, и . IEICE Electron. Express, 13 (11): 20151117 (2016)

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Wang Wang

Linfang Wang

Investigation of the functions of 53BP1 in DNA demethylation. Uni Marburg, (2009)

Paul Wang

Lien Wang

Scheifoo Wang

 

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Multispectral Heterogeneity Detection Based on Frame Accumulation and Deep Learning., , , , , , и . IEEE Access, (2019)Based on reverse molding technology of the impeller of the fluid dynamics analysis., , , и . J. Comput. Methods Sci. Eng., 15 (2): 183-192 (2015)Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application., , и . Microelectron. J., (2022)Design of compact LC lowpass filters based on coaxial through-silicon vias array., , , , , , и . Microelectron. J., (2021)A high-pass filter based on through-silicon via (TSV)., , и . IEICE Electron. Express, 16 (10): 20190098 (2019)A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line., , , , и . IEICE Electron. Express, 19 (3): 20210515 (2022)Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC)., и . IEICE Electron. Express, 13 (11): 20151117 (2016)A novel optimization method for WSN based on mixed matrix decomposition of NMF and 2-SVD-QR., , , , , , и . Ad Hoc Networks, (2021)A transformer with high coupling coefficient and small area based on TSV., , , , и . Integr., (2021)Capacitance characterization of tapered through-silicon-via considering MOS effect., , , , и . Microelectron. J., 45 (2): 205-210 (2014)