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Early Diagnosis and Prediction of Wafer Quality Using Machine Learning on sub-10nm Logic Technology.

H. Ko, S. Park, J. Ryu, S. Kim, G. Lee, D. Lee, S. Pae, E. Lee, Y. Ji, H. Jiang, T. Jeong, T. Uemura, D. Kwon, H. Do, H. Kahng, Y. Cho, J. Lee, and S. Kim. IRPS, page 1-5. IEEE, (2020)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Xavier Lee Lee

Bongsoo Lee

The role of negative regulators in coordination of the Myxococcus xanthus developmental programB. Lee. Uni Marburg, (2009)

Min-Hi Lee

Induction and regulation of antiviral defence mechanisms through intracytoplasmic sensorsM. Lee. HU Berlin, (2009)

Hyemin Lee

Clara Lee

Other publications of authors with the same name

Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique.M. Lee, I. Baick, M. Kim, S. Kwon, M. Yeo, H. Rhee, and E. Lee. IRPS, page 1-6. IEEE, (2021)Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction.H. Jiang, J. Kim, K. Choi, H. Shim, H. Sagong, J. Park, H. Rhee, and E. Lee. IRPS, page 1-6. IEEE, (2021)A classification of the literature on the planning of substitutable products.H. Shin, S. Park, E. Lee, and W. Benton. Eur. J. Oper. Res., 246 (3): 686-699 (2015)Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET.T. Uemura, B. Chung, J. Jo, H. Jiang, Y. Ji, T. Jeong, R. Ranjan, Y. Park, K. Hong, S. Lee and 6 other author(s). IRPS, page 1-5. IEEE, (2020)Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM.T. Uemura, B. Chung, J. Jo, H. Jiang, Y. Ji, T. Jeong, R. Ranjan, S. Lee, H. Rhee, S. Pae and 4 other author(s). IRPS, page 1-4. IEEE, (2020)Holistic approaches to memory solutions for the Autonomous Driving Era.D. Shim, C. Jeong, E. Lee, J. Kang, S. Yoon, Y. Kwon, I. Park, H. Ahn, S. Cha, and J. Kim. ISCAS, page 351-355. IEEE, (2022)CIS Band Noise Prediction Methodology Using Co-Simulation of Camera Module.E. Lee, H. Jun, W. Choi, K. Kwon, J. Lim, S. Lee, and J. Yim. Imaging Sensors and Systems, page 1-5. Society for Imaging Science and Technology, (2020)Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology.S. Kim, U. Jung, S. Choo, K. Choi, T. Chung, S. Chung, E. Lee, J. Park, D. Bae, and M. Um. IRPS, page 11. IEEE, (2022)Early Diagnosis and Prediction of Wafer Quality Using Machine Learning on sub-10nm Logic Technology.H. Ko, S. Park, J. Ryu, S. Kim, G. Lee, D. Lee, S. Pae, E. Lee, Y. Ji, H. Jiang and 8 other author(s). IRPS, page 1-5. IEEE, (2020)

BibSonomy

Disambiguation of "Lee, Euncheol"

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Early Diagnosis and Prediction of Wafer Quality Using Machine Learning on sub-10nm Logic Technology.

Please choose a person to relate this publication to

Xavier Lee Lee

Bongsoo Lee

Min-Hi Lee

Hyemin Lee

Clara Lee

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lee, Euncheol"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Early Diagnosis and Prediction of Wafer Quality Using Machine Learning on sub-10nm Logic Technology.

Please choose a person to relate this publication to

Xavier Lee Lee

Bongsoo Lee

Min-Hi Lee

Hyemin Lee

Clara Lee

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Early Diagnosis and Prediction of Wafer Quality Using Machine Learning on sub-10nm Logic Technology.