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RL-CCD: Concurrent Clock and Data Optimization using Attention-Based Self-Supervised Reinforcement Learning.

Y. Lu, W. Chan, D. Guo, S. Kundu, V. Khandelwal, and S. Lim. DAC, page 1-6. IEEE, (2023)

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Sung-Ki Lim

Yong-Sung Lim

Han-Sung Lim

Sung-Kyu Hong

Sung-Yeun Lim

Other publications of authors with the same name

Distributed TSV Topology for 3-D Power-Supply Networks.M. Healy, and S. Lim. IEEE Trans. Very Large Scale Integr. Syst., 20 (11): 2066-2079 (2012)Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous Systems.G. Murali, H. Park, E. Qin, H. Torun, M. Dolatsara, M. Swaminathan, T. Krishna, and S. Lim. IEEE Trans. Very Large Scale Integr. Syst., 29 (4): 605-616 (2021)Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling.Y. Peng, D. Petranovic, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 34 (12): 1964-1976 (2015)Retiming-based timing analysis with an application to mincut-based global placement.J. Cong, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 23 (12): 1684-1692 (2004)Edge separability-based circuit clustering with application to multilevel circuit partitioning.J. Cong, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 23 (3): 346-357 (2004)Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations.M. Jung, D. Pan, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (11): 1694-1707 (2013)Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs.S. Samal, S. Panth, K. Samadi, M. Saedi, Y. Du, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 35 (10): 1707-1720 (2016)Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.P. Vanna-Iampikul, C. Shao, Y. Lu, S. Pentapati, Y. Heo, J. Choi, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (7): 2331-2335 (July 2023)TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC.M. Jung, J. Mitra, D. Pan, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 31 (8): 1194-1207 (2012)Exploration of temperature-aware refresh schemes for 3D stacked eDRAM caches.Y. Gong, J. Kim, S. Lim, and S. Chung. Microprocess. Microsystems, (2016)

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Disambiguation of "Lim, Sung Kyu"

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RL-CCD: Concurrent Clock and Data Optimization using Attention-Based Self-Supervised Reinforcement Learning.

Please choose a person to relate this publication to

Sung-Ki Lim

Yong-Sung Lim

Han-Sung Lim

Sung-Kyu Hong

Sung-Yeun Lim

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Lim, Sung Kyu"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML RL-CCD: Concurrent Clock and Data Optimization using Attention-Based Self-Supervised Reinforcement Learning.

Please choose a person to relate this publication to

Sung-Ki Lim

Yong-Sung Lim

Han-Sung Lim

Sung-Kyu Hong

Sung-Yeun Lim

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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RL-CCD: Concurrent Clock and Data Optimization using Attention-Based Self-Supervised Reinforcement Learning.