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Disambiguation of "Lim, Sung Kyu"

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Driving Early Physical Synthesis Exploration through End-of-Flow Total Power Prediction.

, , , and . MLCAD, page 97-102. ACM / IEEE, (2022)

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Sung-Ki Lim

Yong-Sung Lim

Han-Sung Lim

Sung-Kyu Hong

Sung-Yeun Lim

 

Other publications of authors with the same name

Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous Systems., , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 29 (4): 605-616 (2021)Distributed TSV Topology for 3-D Power-Supply Networks., and . IEEE Trans. Very Large Scale Integr. Syst., 20 (11): 2066-2079 (2012)Exploration of temperature-aware refresh schemes for 3D stacked eDRAM caches., , , and . Microprocess. Microsystems, (2016)TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 31 (8): 1194-1207 (2012)Edge separability-based circuit clustering with application to multilevel circuit partitioning., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 23 (3): 346-357 (2004)Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (11): 1694-1707 (2013)Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 34 (12): 1964-1976 (2015)Retiming-based timing analysis with an application to mincut-based global placement., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 23 (12): 1684-1692 (2004)Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs., , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 35 (10): 1707-1720 (2016)Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (7): 2331-2335 (July 2023)