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Disambiguation of "Jin, Yufeng"

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Electrical characterization of integrated passive devices using thin film technology for 3D integration.

, , , , , , , and . Journal of Zhejiang University - Science C, 14 (4): 235-243 (2013)

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Yufeng Huang

Yufeng Su

Yufeng Guo

Yufeng Kou

Yufeng Wan

 

Other publications of authors with the same name

Development of TSV simulator: FASTsv., , , , , and . NEMS, page 217-220. IEEE, (2011)In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging., , , , , and . NEMS, page 233-236. IEEE, (2013)A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge., , , , , and . NEMS, page 399-403. IEEE, (2010)A new calibration method for MEMS accelerometers with genetic algorithm., , , and . RCAR, page 240-245. IEEE, (2017)Face Liveness Detection Competition (LivDet-Face) - 2021., , , , , , , , , and 22 other author(s). IJCB, page 1-10. IEEE, (2021)Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging., , , , and . NEMS, page 384-387. IEEE, (2016)New DfT architectures for 3D-SICs with a wireless test port., , , , and . ASICON, page 1-4. IEEE, (2013)Electrical characterization of integrated passive devices using thin film technology for 3D integration., , , , , , , and . Journal of Zhejiang University - Science C, 14 (4): 235-243 (2013)Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array., , , , , , , and . NEMS, page 482-487. IEEE, (2019)Thermal Effect of PMUT and Its Application to the Heat Dissipation of Power Electronics., , , , , , , , and . NEMS, page 540-544. IEEE, (2019)