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TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC.

M. Jung, J. Mitra, D. Pan, and S. Lim. Commun. ACM, 57 (1): 107-115 (2014)

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Uwe Mitransky

Thomas Mitra

Mitra Westermann

Mitra Pourmansour

Mitra Nikpay

Other publications of authors with the same name

Manufacturability-Aware Routing.M. Cho, J. Mitra, and D. Pan. Handbook of Algorithms for Physical Design Automation, Auerbach Publications, (2008)SRAF Insertion via Supervised Dictionary Learning.H. Geng, W. Zhong, H. Yang, Y. Ma, J. Mitra, and B. Yu. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 39 (10): 2849-2859 (2020)HEDD: Human Enhancer Disease Database.Z. Wang, Q. Zhang, W. Zhang, J. rong Lin, Y. Cai, J. Mitra, and Z. Zhang. Nucleic Acids Res., 46 (Database-Issue): D113-D120 (2018)TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC.M. Jung, J. Mitra, D. Pan, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 31 (8): 1194-1207 (2012)Automatic Routability Predictor Development Using Neural Architecture Search.J. Pan, C. Chang, T. Zhang, Z. Xie, J. Hu, W. Qi, C. Lin, R. Liang, J. Mitra, E. Fallon and 1 other author(s). CoRR, (2020)Overview and development of EDA tools for integration of DSA into patterning solutions.J. Torres, G. Fenger, D. Khaira, Y. Ma, Y. Granik, C. Kapral, J. Mitra, P. Krasnova, and D. Ait-Ferhat. ISQED, page 99-103. IEEE, (2017)Optimal deployment of distributed generation using a reliability criterion.J. Mitra, M. Vallem, and C. Singh. IAS, page 1-9. IEEE, (2015)A Direct Method to Calculate Capacity Value of Variable Energy Resources.M. Benidris, S. Sulaeman, and J. Mitra. IAS, page 1-6. IEEE, (2020)BenchPress: Analyzing Android App Vulnerability Benchmark Suites.J. Mitra, and V. Ranganath. CoRR, (2019)Modeling and assessment of PV solar plants for composite system reliability considering radiation variability and component availability.S. Sulaeman, M. Benidris, and J. Mitra. PSCC, page 1-8. IEEE, (2016)

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Disambiguation of "Mitra, Joydeep"

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TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC.

Please choose a person to relate this publication to

Uwe Mitransky

Thomas Mitra

Mitra Westermann

Mitra Pourmansour

Mitra Nikpay

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Mitra, Joydeep"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC.

Please choose a person to relate this publication to

Uwe Mitransky

Thomas Mitra

Mitra Westermann

Mitra Pourmansour

Mitra Nikpay

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC.