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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. EMC Compo, page 158-162. IEEE, (2013)

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Daniel Jung

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TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.J. Kim, D. Jung, H. Kim, S. Kong, S. Choi, J. Lim, and J. Kim. EMC Compo, page 212-215. IEEE, (2015)Fault detection and isolation of multiple defects in through silicon via (TSV) channel.D. Jung, H. Kim, J. Kim, S. Kim, J. Kim, H. Bae, and K. Choi. 3DIC, page 1-5. IEEE, (2014)Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.J. Lim, M. Lee, D. Jung, J. Kim, S. Choi, H. Lee, and J. Kim. EMC Compo, page 248-251. IEEE, (2015)Modeling and analysis of open defect in through silicon via (TSV) channel.D. Jung, H. Kim, J. Kim, J. Kim, H. Bae, and K. Choi. EMC Compo, page 163-166. IEEE, (2013)Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.H. Kim, J. Cho, D. Jung, J. Kim, S. Choi, J. Kim, J. Lee, and K. Park. EMC Compo, page 5-9. IEEE, (2013)Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. EMC Compo, page 158-162. IEEE, (2013)Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.J. Kim, B. Bae, S. Kim, S. Kong, H. Kim, D. Jung, and J. Kim. 3DIC, page 1-6. IEEE, (2014)Eye-diagram simulation and analysis of a high-speed TSV-based channel.H. Kim, J. Cho, J. Kim, D. Jung, S. Choi, J. Kim, J. Lee, and K. Park. 3DIC, page 1-7. IEEE, (2013)Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.J. Kim, H. Kim, S. Kim, B. Bae, D. Jung, S. Kong, J. Kim, J. Lee, and K. Park. 3DIC, page 1-4. IEEE, (2013)Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.S. Choi, H. Kim, D. Jung, J. Kim, J. Lim, H. Lee, K. Cho, J. Kim, H. Kim, Y. Kim and 1 other author(s). 3DIC, page TS8.25.1-TS8.25.5. IEEE, (2015)

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Disambiguation of "Jung, Daniel H."

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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

Please choose a person to relate this publication to

Daniel Jung

Daniel Jung

Daniel Jung

Daniel Jung

Daniel Jung

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Jung, Daniel H."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

Please choose a person to relate this publication to

Daniel Jung

Daniel Jung

Daniel Jung

Daniel Jung

Daniel Jung

Other publications of authors with the same name

Disambiguation

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URL
DOI
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Chicago
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Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.