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Disambiguation of "Kim, Sukjin"

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Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

, , , , , , , , and . 3DIC, page 1-4. IEEE, (2013)

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Ky ng Kim

Die Artikelstruktur in passiven zweisprachigen Wörterbüchern Deutsch-Koreanisch: Konzeption zur Erstellung eines zweisprachigen Lernerwörterbuchs Deutsch-Koreanisch. Uni Heidelberg, (2008)

Kison Kim

Wonchan Kim

Kim Gerber

Bongcheol Kim

 

Other publications of authors with the same name

Fault detection and isolation of multiple defects in through silicon via (TSV) channel., , , , , , and . 3DIC, page 1-5. IEEE, (2014)Incremental training of CNNs for user customization: work-in-progress., , , , , , , , , and 1 other author(s). CASES, page 9:1-9:2. ACM, (2017)Improved B-spline image registration between exhale and inhale lung CT images based on intensity and gradient orientation information., , , , , and . Medical Imaging: Image Processing, volume 9784 of SPIE Proceedings, page 978440. SPIE, (2016)A space- and energy-efficient code Compression/Decompression technique for coarse-grained reconfigurable architectures., , , , , , , , and . CGO, page 197-209. ACM, (2017)Hardware and a Tool Chain for ADRES., , , , , , , , , and 6 other author(s). ARC, volume 3985 of Lecture Notes in Computer Science, page 425-430. Springer, (2006)Fast cycle-accurate compile based simulator for reconfigurable processor., , , and . ISCAS, page 1-4. IEEE, (2017)Direct display interface including video post-processing for 8K UHD TV., , , and . ICCE, page 412-413. IEEE, (2015)Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling., , , , , , , , and . EMC Compo, page 158-162. IEEE, (2013)Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs., , , , , , and . 3DIC, page 1-6. IEEE, (2014)Non-contact wafer-level TSV connectivity test methodology using magnetic coupling., , , , , , , , and . 3DIC, page 1-4. IEEE, (2013)