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Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing.

H. Chen, J. Han, J. Li, and M. Li. Microelectron. Reliab., 52 (6): 1112-1120 (2012)

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Hongtao Du

Hongtao Lu

Hongtao Sun

Chen Chen

Other publications of authors with the same name

Solving High-dimensional Parametric Elliptic Equation Using Tensor Neural Network.H. Chen, R. Fu, Y. Wang, and H. Xie. CoRR, (2024)Designing bag-level multiple-instance feature-weighting algorithms based on the large margin principle.J. Chai, Z. Chen, H. Chen, and X. Ding. Inf. Sci., (2016)Research on Information Literacy of Students in Independent Undergraduate Universities: Empirical Analysis Based on G University.Y. Huang, H. Zhang, C. Yuan, H. Chen, and J. Chen. Int. J. Technol. Hum. Interact., 19 (1): 1-26 (2023)Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test.Q. Guo, S. Sun, Z. Zhang, H. Chen, and M. Li. Microelectron. Reliab., (2018)Study on the cutting force prediction of supercritical material milling.H. Chen, D. Li, S. Huang, and P. Fu. ICNC, page 1148-1152. IEEE, (2010)A full multigrid method for eigenvalue problems.H. Chen, H. Xie, and F. Xu. J. Comput. Phys., (2016)Optimal error estimates for the scalar auxiliary variable finite-element schemes for gradient flows.H. Chen, J. Mao, and J. Shen. Numerische Mathematik, 145 (1): 167-196 (2020)Reduction of the PAPR in OFDM Systems by Intelligently Applying Both PTS and SLM Algorithms.C. Duanmu, and H. Chen. Wireless Personal Communications, 74 (2): 849-863 (2014)Multi fuzzy vault based on secret sharing for deadlock restoration.H. Chen, H. Zhao, L. Pang, J. Liang, and J. Tian. Int. J. Inf. Technol. Manag., 11 (1/2): 50-60 (2012)Decoupled and Unconditionally Energy Stable Finite Element Schemes for Electrohydrodynamic Model with Variable Density.Y. He, and H. Chen. J. Sci. Comput., 96 (3): 78 (September 2023)

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Disambiguation of "Chen, Hongtao"

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Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing.

Please choose a person to relate this publication to

Hongtao Du

Hongtao Lu

Hongtao Sun

Chen Chen

Chen Chen

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Chen, Hongtao"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing.

Please choose a person to relate this publication to

Hongtao Du

Hongtao Lu

Hongtao Sun

Chen Chen

Chen Chen

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing.