%0 Conference Paper %1 conf/3dic/NaeimYCBDSBCPBM23 %A Naeim, Mohamed %A Yang, Hanqi %A Chen, Pinhong %A Bao, Rong %A Dekeyser, Antoine %A Sisto, Giuliano %A Brunion, Moritz %A Chen, Rongmei %A der Plas, Geert Van %A Beyne, Eric %A Milojevic, Dragomir %B 3DIC %D 2023 %I IEEE %K dblp %P 1-4 %T Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2023.html#NaeimYCBDSBCPBM23 %@ 979-8-3503-1137-2

@inproceedings{conf/3dic/NaeimYCBDSBCPBM23, added-at = {2023-09-30T00:00:00.000+0200}, author = {Naeim, Mohamed and Yang, Hanqi and Chen, Pinhong and Bao, Rong and Dekeyser, Antoine and Sisto, Giuliano and Brunion, Moritz and Chen, Rongmei and der Plas, Geert Van and Beyne, Eric and Milojevic, Dragomir}, biburl = {https://www.bibsonomy.org/bibtex/2ff5b645ceafe4425cd0c264de0d803fe/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2023}, ee = {https://doi.org/10.1109/3DIC57175.2023.10155075}, interhash = {08829eee6236440fe84b869866eb1dea}, intrahash = {ff5b645ceafe4425cd0c264de0d803fe}, isbn = {979-8-3503-1137-2}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-09T12:47:42.000+0200}, title = {Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2023.html#NaeimYCBDSBCPBM23}, year = 2023 }