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Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.

, , , , , , , , , , и . 3DIC, стр. 1-4. IEEE, (2023)

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Milos Milojevic

Marko Milojevic

Dragomir Tadic

Dragomir Nešić

Dragomir Gaji

 

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