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Design of Test Modules for the Analysis of MCM Interconnects., , and . ED&TC, page 614. IEEE Computer Society, (1996)Design issues in heterogeneous 3D/2.5D integration., , , , , and . ASP-DAC, page 403-410. IEEE, (2013)Impact of 3D design choices on manufacturing cost., , , , and . 3DIC, page 1-5. IEEE, (2009)A novel concept for ultra-low capacitance via-last TSV., , , , , and . 3DIC, page 1-4. IEEE, (2010)In-tier diagnosis of power domains in 3D TSV ICs., , , , , , , , , and 1 other author(s). 3DIC, page 1-6. IEEE, (2011)Constant Impedance Scaling Paradigm for Scaling LC transmission lines., , , , , , and . ISQED, page 387-392. IEEE Computer Society, (2006)Active-lite interposer for 2.5 & 3D integration., , , , , , , , , and 5 other author(s). VLSIC, page 222-. IEEE, (2015)Thermal experimental and modeling analysis of high power 3D packages., , , , , and . ICICDT, page 1-4. IEEE, (2015)IP Session on Chiplet: Design, Assembly, and Test., , , , and . VTS, page 1. IEEE, (2023)Tutorial T7A: Advanced IC Packaging.. VLSI Design, page 10. IEEE Computer Society, (2007)