%0 Conference Paper %1 conf/3dic/MatsumotoISY09 %A Matsumoto, Keiji %A Ibaraki, Soichiro %A Sakuma, Katsuyuki %A Yamada, Fumiaki %B 3DIC %D 2009 %I IEEE %K dblp %P 1-5 %T Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#MatsumotoISY09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/MatsumotoISY09, added-at = {2019-10-19T00:00:00.000+0200}, author = {Matsumoto, Keiji and Ibaraki, Soichiro and Sakuma, Katsuyuki and Yamada, Fumiaki}, biburl = {https://www.bibsonomy.org/bibtex/2e51204a3a037bab4bbb229ac42583785/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306546}, interhash = {514b9597993acc613ef94d02058f8347}, intrahash = {e51204a3a037bab4bbb229ac42583785}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:14.000+0200}, title = {Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#MatsumotoISY09}, year = 2009 }