( en | de | ru )

 

Disambiguation of "Yamada, Fumiaki"

Author of the publication

copydeleteadd this publication to your clipboard
Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.

, , , and . 3DIC, page 1-5. IEEE, (2009)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Chisaburo Yamada

Osamu Yamada

Hitoshi Yamada

Keiichi Yamada

Peter Fumiaki Momose

 

Other publications of authors with the same name

High density 3D integration by pre-applied Inter Chip Fill., , , , , , , , and . 3DIC, page 1-5. IEEE, (2010)Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package., , , , , , , , and . 3DIC, page 1-6. IEEE, (2011)Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill., and . 3DIC, page 1-4. IEEE, (2009)Robust control of active suspension to improve ride comfort with structural constraints., , , , and . AMC, page 103-108. IEEE, (2016)Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack., , , , , , , , , and 1 other author(s). 3DIC, page 1-8. IEEE, (2013)Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration., , , , , , , , and . 3DIC, page 1-7. IEEE, (2011)Thermo-mechanical evaluation of 3D packages., , , , , , and . 3DIC, page 1-4. IEEE, (2013)Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack., , , and . 3DIC, page 1-5. IEEE, (2009)10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack., , , , , , , , , and . 3DIC, page 1-6. IEEE, (2009)