%0 Conference Paper %1 conf/3dic/NorikiLBFTK10 %A Noriki, Akihiro %A Lee, Kang Wook %A Bea, Jichoel %A Fukushima, Takafumi %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B 3DIC %D 2010 %I IEEE %K dblp %P 1-4 %T Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#NorikiLBFTK10 %@ 978-1-4577-0526-7

@inproceedings{conf/3dic/NorikiLBFTK10, added-at = {2021-02-16T00:00:00.000+0100}, author = {Noriki, Akihiro and Lee, Kang Wook and Bea, Jichoel and Fukushima, Takafumi and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/28c1b99683fee8f03231c64880cdb0425/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2010}, ee = {https://doi.org/10.1109/3DIC.2010.5751435}, interhash = {883d5cc22a6bad84f9693d4b09ea0f2c}, intrahash = {8c1b99683fee8f03231c64880cdb0425}, isbn = {978-1-4577-0526-7}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:11:20.000+0200}, title = {Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#NorikiLBFTK10}, year = 2010 }