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Disambiguation of "Lee, Kang Wook"

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Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

, , , , , and . 3DIC, page 1-4. IEEE, (2010)

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Wook Lee

Wook Lee

Hae Wook Lee

Myung-Wook Lee

Sang-Wook Lee

 

Other publications of authors with the same name

Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration., , , , , , , and . 3DIC, page 1-4. IEEE, (2014)Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications., , , , , and . 3DIC, page TS5.2.1-TS5.2.5. IEEE, (2015)Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding., , , , , , and . 3DIC, page 1-5. IEEE, (2010)Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI., , , , , and . 3DIC, page 1-4. IEEE, (2011)Chip-level TSV integration for rapid prototyping of 3D system LSIs., , , , , , , , and . 3DIC, page 1-4. IEEE, (2011)10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack., , , , , , , , , and . 3DIC, page 1-6. IEEE, (2009)3D integration technology for 3D stacked retinal chip., , , , , , and . 3DIC, page 1-4. IEEE, (2009)Development of via-last 3D integration technologies using a new temporary adhesive system., , , , and . 3DIC, page 1-4. IEEE, (2013)Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM., , , , , and . IRPS, page 4. IEEE, (2015)Speeding up distributed storage and computing systems using codes.. University of California, Berkeley, USA, (2016)base-search.net (ftcdlib:qt0jb2g9pp).