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A 0.57-mW/Gbps, 2ch × 53-Gbps Low-Power PAM4 Transmitter Front-End Flip-Chip-Bonded 1.3-µm LD-Array-on-Si., , , , , , , , , и . OFC, стр. 1-3. IEEE, (2020)160-Gbps Nyquist PAM4 transmitter using a digital-preprocessed analog-multiplexed DAC., , , , , , и . ECOC, стр. 1-3. IEEE, (2015)300-GHz 120-Gb/s Wireless Transceiver with High-Output-Power and High-Gain Power Amplifier Based on 80-nm InP-HEMT Technology., , , , , , и . BCICTS, стр. 1-4. IEEE, (2019)A 110-GHz-Bandwidth 2: 1 AMUX-Driver using 250-nm InP DHBTs for Beyond-1-Tb/s/carrier Optical Transmission Systems., , , , , , , , , и 1 other автор(ы). BCICTS, стр. 1-4. IEEE, (2019)12.3 A 48GHz BW 225mW/ch Linear Driver IC with Stacked Current-Reuse Architecture in 65nm CMOS for Beyond-400Gb/s Coherent Optical Transmitters., , , , и . ISSCC, стр. 212-214. IEEE, (2020)A 25-Gb/s 13 mW clock and data recovery using C2MOS D-flip-flop in 65-nm CMOS., , , , , , , , и . VLSI-DAT, стр. 1-4. IEEE, (2018)Ultrahigh-Speed Low-Power DACs Using InP HBTs for Beyond-100-Gb/s/ch Optical Transmission Systems., , , , и . IEEE J. Solid State Circuits, 46 (10): 2215-2225 (2011)A 256-Gbps PAM-4 Signal Generator IC in 0.25-µm InP DHBT Technology., , , , , , и . BCICTS, стр. 28-31. IEEE, (2018)120-GBaud 32QAM Signal Generation using Ultra-Broadband Electrical Bandwidth Doubler., , , , , , , , и . OFC, стр. 1-3. IEEE, (2019)192-Gbaud Signal Generation using Ultra-Broadband Optical Frontend Module Integrated with Bandwidth Multiplexing Function., , , , , , , , , и . OFC, стр. 1-3. IEEE, (2019)