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Numerical approach to predict power device reliability., , , , , and . DTIS, page 1-5. IEEE, (2018)Power Packages Interconnections for High Reliability Automotive Applications., , , and . ESSDERC, page 35-39. IEEE, (2019)Fast transient thermomechanical stress to set a pressure-assisted sintering process., , , , , and . PRIME, page 61-64. IEEE, (2019)Identification of Interface States responsible for VTH Hysteresis in packaged SiC MOSFETs., , , , , , , , and . IRPS, page 5. IEEE, (2022)Deep Learning Algorithm for Advanced Level-3 Inverse-Modeling of Silicon-Carbide Power MOSFET Devices., , , , , , and . CoRR, (2023)Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules., , , , , , , , , and 1 other author(s). IEEE Trans. Intell. Veh., 8 (12): 4734-4753 (December 2023)Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction., , , and . IEEE Access, (2021)Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling., , , and . IEEE Access, (2021)Deep Learning Car Driver Motion Magnified Saccadic Eye Movements for Advanced Driving Assistance System., , , , , and . IJCNN, page 1-9. IEEE, (2022)